Epoxy Resins and Composites 4 by K Dusek

By K Dusek

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65, Proc. 26th SAMPE Symposium, 1981 15. Senturia, S. , N. , Lee, H. , Marshall, S. , 19, 22 (1983) 16. Aukward, J. , Warfield, R. , Petree, M. C, : Change in electrical resistivity of some high polymers during isothermal polymerization, J. , 27, 199 (1958) 17. Anonymous: Dielectrics improve control of laminate cure time, Plastics Technology, 15, 19 (1969) 18. , Palo Alto, CA: Manual for HP4192A Low-Frequency Impedance Analyzer 19. , Concord MA: Manual for 1689 Digibridge 20. , Cambridge, MA: The Eumetric System II Microdielectrometer, Product Bulletin, 1985 21.

A second method for analyzing the dipolar relaxation in curing systems is to compare isothermal cure time required to reach the dipole loss peak with cure time required to reach other events, such as vitrification as measured with torsional braid analysis. One interesting result of Sheppard's analysis of pure epoxies 46) is that the loss peak measured in the frequency range 1-3 Hz tracks Tg as measured by DSC. Extrapolating from this result, one expects that during cure the time to reach the dipole loss peak at about 1 Hz should fall near the vitrification boundary of the time-temperature-transformation (TTT) diagram 78) .

Transducers '85, 1985 8. Mopsik, F. I. : Precision time-domain dielectric spectrometer, Rev. Sei. Instr. 55, 79 (1984) 9. Aukward, J. , Warfield, R. W. : Monitoring device for investigation of encapsulating resins, Rev. Sei. , 27, 413 (1956) 10. Armstrong, R. S. Patent No. 3,600,247 11. S. Thesis, Massachusetts Institute of Technology, 1985, unpublished 12. Lee, H. S. Thesis, Massachusetts Institute of Technology, 1982, unpublished 13. Senturia, S. , Garverick, S. S. Patent No. 4,423,371 14. , Garverick, S.

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